Publications

Papers in Referred Journals

  • E. Uhlmann, B. Mullany, D. Biermann, K. P. Rajurkar , T. Hausottee, E. Brinksmeier, “Process Chains for High-Precision Components with Micro-Scale Features”, Annals of the CIRP, Vol. 65 (2), pp. 549-572, 2016.
  • H. Shahinian, H. Cherukuri, B. Mullany, “An Evaluation of Fiber-Based Tools for Glass Polishing Using Experimental and Computational Approaches”, Applied Optics, Vol 55, Issue 16, Pages 4307-4316, 2016.
  • E. Fleischhauer , F. Azimi, P. Tkacik, R. Keanini, B. Mullany,  “Application of Particle Image Velocimetry (PIV) to Vibrational Finishing”, Journal of Materials Processing Technology, Volume 229, Pages 322-328, March, 2016.
  • Y. Dong, T. Hutchens, B. Mullany, E. Morse, A. Davies “Using a 3-D optical simulation to investigate uncertainty in image-based dimensional measurements”,Opt. Eng. 53(9), 092007, May 07, 2014.
  • S. Howard, J. Chesna, S. Smith, B. Mullany, “On the Development of an Experimental Testing Platform for the Vortex Machining Process”, J. Manuf. Sci. Eng. 135(5), 2013.
  • B. Zheng, Y. Dong, B. Mullany, E. Morse, A. Davies,” Positioning Sensor by Combining Photogrammetry, Optical Projection and a Virtual Camera Model”, Measurement Science and Technology, Vol. 24(10), 2013.
  • B. Mullany, M. Mainuddin, W. Williams, R. Keanini, An Experimental and Analytical Investigation into the Effects of Process Vibrations on Material Removal Rates during Polishing, Journal of Applied Physics, Vol13, (22),2013.
  • Zheng B., Dong Y., Mullany B., Morse E., Davies A., “Using Optical Projection in Close-range Photogrammetry for 6DOF Sensor Positioning”, Photogramm. Eng. Remote Sens., Vol. 79, No.1, pp79-86, 2013.
  • B. Mullany, M. Mainuddin, “The Influence of Process Vibrations on Precision Polishing Metrics”, Annals of the CIRP, 61/1/2012, 555-558, 2012.
  • W. Williams, B. Mullany, P. Moyer, W. Parker, M. Randles, Using Quantum Dots to Evaluate Subsurface Damage Depths & Formation Mechanisms in Glass, Annals of the CIRP, 59/1/2010, 569-572, 2010.
  • B. Mullany, S. Turner,”Optical Polishing Pitches: Impact Frequency Responses and Indentation Depths”, Applied Optics, Vol. 49, No. 3, pp. 442 – 449, 2010.
  • B. Nowakowski, S.T. Smith, B.A. Mullany, S.C. Woody, “Vortex Machining: Localized Surface Modification Using an Oscillating Fiber Probe”, Machining Science and Technology, Vol. 13, No.4, pp. 561 – 570, 2009.
  • W. Williams, B. Mullany, P. Moyer, W. Parker, M. Randles, Using Quantum dots to Tag Subsurface Damage in Lapped and Polished Glass Samples, Applied Optics, Vol. 48, No. 28, pp. 5155-5163, 2009.
  • B. Mullany, Monte Carlo Analysis of Machine Tool Positional Accuracy and Repeatability Standards, Transactions of NAMRI/SME, pp. 309-316, Vol. 36, 2008.
  • M. Davies, T. Ueda, R. M. Saoubi, B. Mullany, A.L. Cooke, On The Measurement of Temperature in Material Removal Processes, Annals of the CIRP, 55/2/2007.
  • C. Evans, E. Paul, D. Dornfeld, D.A. Lucca, G. Byrne, M. Tricard, F. Klocke, O. Dambon and B.A. Mullany, Material Removal Mechanisms in Lapping and Polishing, CIRP Annals vol. 52/2/2003.
  • B. Mullany, G. Byrne, The Effect of Slurry Viscosity on the Chemical Mechanical Polishing (CMP) of Silicon Wafers, Journal of Materials Processing Technology, 132, pp. 28-34, 2003.
  • B. Mullany, G. Byrne, P. Young, The Effect of Pad Wear on the Chemical Mechanical Polishing of Silicon Wafers, CIRP Annals, vol 48/1/1999, pp. 143-146, (ISBN 3-905 277-31-X), 1999.


Referred Conference Proceedings

  • G. Byrne, E. Ahearne, M. Cotterell, B. Mullany, G.E. O’Donnell, F. Sammler, “High Performance Cutting (HPC) in the New Era of Digital Manufacturing – A Roadmap”, 7th HPC CIRP Conference on High Performance Cutting (HPC), Procedia CIRP 46 (2016) 1-6.
  • H. Shahinian, B. Mullany, “Optical Polishing using Fiber Based Tools”, 3rd CIRP Conference on Surface Integrity (CSI), Charlotte, Procedia CIRP 45 (2016) 183-186.
  • M. Mainuddin, R. Keanini, B. Mullany, “Utilizing Small External Vibrational Sources to Increase Polishing Material Removal Rates”, MSEC, Charlotte, NC, June 2015.
  • B. Mullany, B. Linke, M. Jackson, “Abrasive Technologies: Current Research Activities and Directions – Highlights of the ASME 2014 Manufacturing Science and Engineering Conference (MSEC2014)”, Optical Fabrication and Testing (OF&T), Paper OTh1B.4, June, Kona, HW 2014.
  • M. Mainuddin, B. Mullany, “Evaluating the Effect of Single Frequency Vibrations on Pitch Polishing Outcomes”, to be published in Optical Fabrication and Testing (OF&T), Paper OM4D.5, June, Monterey, CA 2012.
  • S. Howard, J. Chesna, B. Mullany, S.T. Smith,” Observations During Vortex Machining Process Development,” MSEC 2012, Notre Dame, Indiana, June 2012.
  • M. Mainuddin, B. Mullany, ‘Evaluating the influence of vibrations in precision polishing’, Optifab, Rochester, NY, May 2011
  • B. Mullany, J. Beaman, “The response of pitch to higher frequency vibrations”, Topical Meeting of the Optical Fabrication & Testing (OF&T), Jackson Hole, WY, OThB5, June 2010
  • W. Williams, B. Mullany, P.Moyer, W. Parker, M. Randles, ” Evaluating Subsruface Damage with Quantum Dots”, Topical Meeting of the Optical Fabrication & Testing (OF&T), Jackson Hole, WY, OWA3, June 2010
  • W. Williams, B. Mullany, P.Moyer, W. Parker, “Adding quantum dots to abrasive slurries to detect subsurface damage in polished glass”, Technical Digest, Optifab 2009, Rochester, TD06-34, May 2009
  • B. Mullany, E. Corcoran, “Frequency response of polishing pitch samples”, Technical Digest, Optifab 2009, Rochester, TD06-04, May 2009
  • B. Mullany, E Corcoran, “New Metrics for Polishing Pitch”, Topical Meeting of the Optical Fabrication & Testing (OF&T) Topical Meeting, Rochester, NY, Oct 2008.
  • B. Mullany, E Corcoran, “An Innovative Look at Precision Polishing Tools”, Proceedings of the 3rd CIRP International Conference on High Performance Cutting, Dublin, Ireland, June 12-13, ISBN 978-1-905254-32-3, pp 589-598, 2008.
  • B. Mullany, A. Landis, W. Williams, P. Murray, I. Roberts, Pitch polishing of silica – Correlation between material removal rates and obtainable surface finishes, Optifab 2007, CD 260, TD04-53, May 2007.
  • B. Mullany, E. Corcoran, Off the shelf PTFE as a fine polishing pad, Technical Digest, Optifab 2007, CD 260, TD04-51, May 2007.
  • A. Bielke, K. Beckstette, C. Kübler, B. Mullany, M. Pollmann, H. Wang, Fabrication of Aspheric Optics Process Challenges arising from a wide range of Customer Demands and Diversity of Machine Technologies, SPIE proceedings, St Etiennes, France, Oct 2003.

 

Conference Proceedings based on Reviewed Abstract

 

  • F. Azimi, E. Fleischhauer, P. Tkacik, R. Keanini ,B. Mullany, “Correlations Between Media-Workpiece Contact Modes Occurring During Vibrational Finishing and the Resulting Workpiece Topography”, 15th International Conference on Metrology and Properties of Engineering Surfaces, Charlotte, NC, March 2015.
  • J. Hunt, S. Howard, B. Mullany, S.T. Smith, “Investigation of Tooling Effects, Slurry Composition and Workpiece Material in Vortex Machining”, Proceedings of the 28th Annual Meeting of the American Society for Precision Engineering, November, St. Paul, Minnesota, 2013
  • Stephen Howard, Brigid Mullany, Stuart Smith, Design and Implementation of a High-Power Machining Facility for Investigations in Vortex Machining, Proceedings of the 13th euspen International Conference, Berlin, May 2013.
  • S. Howard, B. Mullany, S.T. Smith, “Preliminary Characterization of Vortex Machining”, to be published in the Proceedings of the 12th International Conference and 4th General Meeting of the European Society for Precision Engineering and Nanotechnology, 2012.
  • Bowes, K. E. Dong, Y.; Mullany, B. A.; Morse, E. P.; Davies, A. D., “Form Measurements of Specular Parts by Combining Beam Propagation, Optical Scattering, and Photogrammetry”, Proceedings of the 26th Annual Meeting of the American Society for Precision Engineering, November, Denver, Colorado, 2011
  • Dong, Y.; Hutchens, T.; Mullany, B. A.; Morse, E. P.; Davies, A. D., “Using an Optical Software Package to Analyze Photogrammetry System Errors”, Proceedings of the 26th Annual Meeting of the American Society for Precision Engineering, November, Denver, Colorado, 2011
  • Howard, S. C.; Chesna, J. W.; Mullany, B. A.; Smith, S. T., “Subcomponent Developments for a Vortex Machining Test Facility”, Proceedings of the 26th Annual Meeting of the American Society for Precision Engineering, November, Denver, Colorado, 2011.
  • Mainuddin, M.; Browy, E.; Mullany, B. A., “Design of a Test Platform to Investigate the Role of Process Vibrations in Precision Polishing” , Proceedings of the 26th Annual Meeting of the American Society for Precision Engineering, November, Denver, Colorado, 2011.
  • Zheng, B.; Mullany, B. A.; Morse, E. P. ; Davies, A. D., “Position Sensoring Module by Combining Photogrammetry and Projection Pattern” , Proceedings of the 26th Annual Meeting of the American Society for Precision Engineering, November, Denver, Colorado, 2011.
  • K. Bowes, B. Mullany, E. Morse, A. Davies, A, “Surface Form Measurements Combining Beam Propagation, Optical Scattering, and Photogrammetry”, Extended abstract for the ASPE Spring Topical Meeting at UNC Charlotte, NC, March 2011.
  • M. Mainuddin, B. Mullany, “Vibration Attentuation in Optical Pitch”, Extended Abstract for the ASPE Meeting in Oct, 2010.
  • W. Williams, B. Mullany, P. Moyer, W. Parker, M. Randles, Testing Quantum Dots as a Means of Assessing Subsurface Damage in Polished Glass, Extended Abstract for the ASPE Meeting in Oct, 2009.
  • B. Mullany, S. Turner, E. Corcoran, Steady-State Dynamic Testing of Polishing Pitch, Extended Abstract for the ASPE Meeting in Oct, 2009.
  • W. Williams, B. Mullany, P. Moyer, W. Parker, M. Randles,  Characterizing Quantum Dots for Use in Detecting Subsurface Damage, Proceedings of the 23rd Annual Meeting of the American Society for Precision Engineering, October 19-24, Portland, Oregon, Volume 44, p. 440, 2008.
  • B. Mullany, W. Williams, Real time measurement of Friction and Vibration during Polishing, ASPE Conference, October 2006.
  • B. Mullany, G. Byrne, Pad-Wafer Interface Temperatures during Chemical Mechanical Polishing (CMP) of Oxide Coated Silicon Wafers, Proceedings of the 3rd International Conference and 4th General Meeting of the European Society for Precision Engineering and Nanotechnology, Vol. 1, pp. 261-264, 2002.
  • B. Mullany, G. Byrne, M. Power, The Effect of Slurry Viscosity on CMP, 2000 Proceedings of the Seventeenth International VLSI Multi-level Interconnection Conference (VMIC), June 27-29, pp. 525-521, 2000 (invited paper).
  • B. Mullany, G. Byrne, M. Power, The Effect of Polishing Pad Geometry on CMP Planarisation Capabilities, Euspen Conference Proceedings Vol. 1, pp. 400-403, (ISBN 3-8265 6085-X), May 1999.
  • B. Mullany, G. Byrne, M. Power, The Effect of Polishing Pad Conditioning on the Planarisation Capability of the Chemical Mechanical Polishing Process, Proceedings of the Chemical Mechanical Polishing (CMP) for ULSI Multi-scale Interconnection Conference, pp. 147-150 (Library of Congress No. 89-644090), Feb. 1999.
  • B. Mullany, P. Young, G. Byrne, FEM Analysis of Pad Conditions in the Chemical Mechanical Polishing of Silicon Wafers, Proceedings of the Fifteenth Conference of the Irish Manufacturing Committee, pp. 37-44, Sept 1998.
  • B. Mullany, G. Byrne, P. Young, S. Galligan, Global Planarity of Silicon Wafers resulting from Chemical Mechanical Polishing, IMC-14 Proceedings of the Fourteenth Conference of the Irish Manufacturing Committee, pp. 451-459, Sept. 1997.